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hot air + Infrared manual bga rework station for mobile phone chips soldering wds580

shenzhen wisdomshow technology co.,ltd

hot air + Infrared manual bga rework station for mobile phone chips soldering wds580

Brand Name : wisdomshow

Model Number : wds580

Certification : ce

Place of Origin : cn

MOQ : 1

Price : 1480usd

Payment Terms : T/T, Western Union, MoneyGram,paypal

Supply Ability : 452pcs per month

Delivery Time : 5

Packaging Details : wooden box

color : blue+brown

warranty : 1 year

weight : about 45kg

power : 110/220V optional

working way : hot air + infrared

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3 Zones hot air BGA Rework Station Semi-automatic Mobile phone repair machine for Laptops/Game consoles 220V 4800W

hot air + Infrared SMT SMD Rework Soldering Stations wds580 BGA Repair Machine

Parameter

Total Power4800W
Upper Heating Power800W
Lower Heating Power1200W
Infrared Heating Power2700W(1200W is controlled)
Power supply(Single Phase) AC 220V±10 50Hz
Location wayV-shape card slot + Universal jigs
Temperature Controlling

K-type thermocouple closed loop control, independent temperature

control, precision up to ±3 degree

Electrical MaterialTouch screen + Temperature control module + PLC control
Max PCB size400×370mm
Min PCB size10×10mm
Sensor1 unit
PCB Thickness0.3-5mm
Suitable Chip Size2*2mm-60*60mm
Machine Size500×590×650mm
WeightNet 40kg

Nozzle x 5(top 18,28,38,41mm; bottom 55mm)

WDS580 BGA Rework station Feature

1. Adopted with Linear slider, so all the three axles (X, Y, and Z) can do fine tuning and quick orientation with perfect positioning accuracy and speedily maneuverability.


2. Equipped with touch panel interface and PLC controlling to ensure it work stably and reliably. And it can storage multiple temperature profiling data of users. With password protection and modification function while power on. The temperature profiles will be displayed on the touch screen.


3. Three temperature zones to heat up independently, hot air heat up between up and down zones, IR heat in the bottom, temperature precise control is in±3℃.The upper temperature zone can be moved freely according to needs, the second zone can be adjusted up and down. The top and bottom heaters can be set several segments control at the same time. IR heating zone can be adjusted output power in the light of operation requirements.


4. The hot air nozzle can be rotated in 360 degree, the IR heater in the bottom can heat up the PCB board uniformly.


5. High accuracy K-type thermocouple closed-loop controlling. It can test temperature accurately through external temperature measurement interface, PCB board positioned by closed V-shape slot. The flexible and convenient universal jigs can prevent any damage or PCB deformation as well as it is suitable for all size of BGA package.


6. Large power fan to cool down the PCB quickly. The built-in vacuum pump and external vacuum nozzle is able to take BGA chips out easily.


7. Having alarm prompt function after welding is done, specially added early warning function for convenient operation.


8. It has Passed CE certificate. It is equipped with emergency stop switch and protection equipment to power off automatically when abnormal accident happened. Under this situation that temperature is out of control, circuit can automatically cut off the power with double over temperature protection function.

Item pictures

want more details :

contact ivy zhou

whatsapp+8613825209905 skype ivyzhou90


China hot air + Infrared manual bga rework station for mobile phone chips soldering wds580 wholesale

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